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| BB644/BB664... Silicon Variable Capacitance Diodes * For VHF TV-tuners * High capacitance ratio * Low series inductance * Low series resistance * Excellent uniformity and matching due to "in-line" matching assembly procedure * Pb-free (RoHS compliant) package 1) * Qualified according AEC Q101 BB644 BB664/-02V Type BB644 BB664 BB664-02V Package SOD323 SCD80 SC79 Configuration single single single LS(nH) 1.8 0.6 0.6 Marking yellow 4 44 4 Maximum Ratings at TA = 25C, unless otherwise specified Parameter Diode reverse voltage Peak reverse voltage R 5k Forward current Operating temperature range Storage temperature 1Pb-containing Symbol VR VRM IF Top Tstg Value 30 35 20 -55 ... 150 -55 ... 150 Unit V mA C package may be available upon special request 1 2007-04-20 BB644/BB664... Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Values Parameter min. DC Characteristics Reverse current VR = 30 V VR = 30 V, TA = 85 C AC Characteristics Diode capacitance VR = 1 V, f = 1 MHz VR = 2 V, f = 1 MHz VR = 25 V, f = 1 MHz VR = 28 V, f = 1 MHz CT Unit max. nA typ. IR 10 100 pF 39 29.4 2.5 2.4 15 11 41.8 31.85 2.7 2.55 16.4 11.8 0.6 44.5 34.2 2.85 2.75 17.8 12.6 2 0.75 % Capacitance ratio VR = 1 V, VR = 28 V, f = 1 MHz CT1 /CT28 CT2 /CT25 Capacitance ratio VR = 2 V, VR = 25 V, f = 1 MHz Capacitance matching1) VR = 1 ... 28 V, f = 1 MHz, 7 diodes sequence CT/CT rS Series resistance VR = 5 V, f = 470 MHz 1For details please refer to Application Note 047. 2 2007-04-20 BB644/BB664... Diode capacitance CT = (VR) f = 1MHz Temperature coefficient of the diode capacitance TCc = (VR) 10 -3 70 pF 60 55 50 1/C CT 45 40 35 30 25 20 15 10 5 0 0 5 10 15 20 25 V TCC 10 -4 10 -5 0 10 35 10 1 V 10 2 VR VR Reverse current IR = (VR) TA = Parameter 10 -9 A 85C IR 10 -10 25C 10 -11 0 4 8 12 16 20 24 V 30 VR 3 2007-04-20 Package SC79 BB644/BB664... Package Outline 0.2 0.8 0.1 10MAX. M A 0.13 -0.03 +0.05 2 1.6 0.1 0.55 0.04 Foot Print 1.35 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel o330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.33 1.96 Cathode marking 0.4 0.93 8 0.2 0.05 0.66 Cathode marking 1 0.3 0.05 Cathode marking 10MAX. 1.2 0.1 A 4 2007-04-20 Package SCD80 BB644/BB664... Package Outline 0.2 0.8 0.1 10MAX. M A +0.05 0.13 -0.03 A 7 1.5 1.3 0.1 2 1.7 0.1 0.7 0.1 Foot Print 1.45 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel o330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.45 2.5 8 0.2 0.05 Cathode marking 1 0.3 0.05 Cathode marking 0.4 0.9 Cathode marking 0.7 5 2007-04-20 BB644/BB664... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 01 02 03 04 05 06 07 08 09 10 11 12 a b c d e f g h j k l n 2 0 04 p q r s t u v x y z 2 3 2005 A B C D E F G H J K L N 2006 P Q R S T U V X Y Z 4 5 2 0 07 a b c d e f g h j k l n 2008 p q r s t u v x y z 2 3 2009 A B C D E F G H J K L N 2010 P Q R S T U V X Y Z 4 5 2011 a b c d e f g h j k l n 2012 p q r s t u v x y z 2 3 2 0 13 A B C D E F G H J K L N 2014 P Q R S T U V X Y Z 4 5 1) New Marking Layout for SC75, implemented at October 2005. . 6 2007-04-20 Package SOD323 BB644/BB664... Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1 0 0.05 A 1.7 +0.2 -0.1 +0.05 0.3 -0.2 2 Cathode marking 1 0.3 +0.1 -0.05 0.25 M A 0.45 0.15 2.5 0.2 0.15 +0.1 -0.06 Foot Print 0.6 Marking Layout (Example) 0.8 1.7 0.8 BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.2 2 2.9 8 Cathode marking 0.65 1.35 1 7 2007-04-20 BB644/BB664... Edition 2006-02-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 8 2007-04-20 |
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